RGM & Microsystech at MECSPE 2019

For the third year RGM will participate at MECSPE, Parma, March 28th – 30th, 2019

Come to visit us at Booth 4.1, Stand A14 – Subfornitura Elettronica

RGM & Microsystech team will show you the newest innovative solutions

  • Hybrid Power Modules for special applications
  • Wire Bonding Technology
  • PCB in SMT – THT Technologies

Don’t miss our special Aperitivo with Prosecco and Genovese Focaccia – Every day from h:17:00

FIND OUT MORE ABOUT THE FAIR