RGM & Microsystech at MECSPE, March 28th – 30th, 2019

For the third year RGM will participate at MECSPE 2019.

Come to visit us at Booth 4.1, Stand A14 – Subfornitura Elettronica

RGM & Microsystech team will show you the newest innovative solutions

  • Hybrid Power Modules for special applications
  • Wire Bonding Technology
  • PCB in SMT – THT Technologies